Toshiba Enhances Network FCRAM(TM) Product Line With Industrial Temperature Memory ICs
Meets OEMs' Demand for High Performance Memory Able to Operate in Temperature Conditions From -40 to 100 Degrees Celsius
IRVINE, Calif., Feb. 27 /PRNewswire/ -- Expanding its portfolio of high performance DRAM technology, Toshiba America Electronic Components, Inc. (TAEC)* today announced the introduction of the first industrial temperature Network Fast Cycle Random Access Memory (FCRAM(TM)) with guaranteed wider operating case temperatures extending from -40 degrees Celsius (C) up to 100 degrees C. The new memory integrated circuits (ICs) were developed by Toshiba Corporation (Toshiba) in response to network equipment OEM demand for high-performance memory devices to support network equipment deployed in the field that requires a wider operating temperature range.
Toshiba's new high-performance industrial temperature FCRAM2 memory ICs, designated TC59LM818DMBI, support clock frequencies up to 267MHz (533Mbps) and random cycle times down to 25ns. The 18-bit device is organized as 4M words x 4 banks x 18 bits, and possesses an operating case temperature range of -40 degrees C to 100 degrees C.
Toshiba's new industrial temperature Network FCRAM1 memory ICs, designated TC59LM814CFTI and TC59LM806CFTI, support clock frequencies up to 167MHz (333Mbps) and random cycle times down to 30ns. The TC59LM814CFTI IC is organized as 4M words x 4 banks x 16 bits, while the TC59LM806CFTI is organized as 8M words x 4 banks x 8 bits. The new devices have an operating ambient temperature range of 85 degrees C down to -40 degrees C.
"The addition of industrial temperature ICs to Toshiba's Network FCRAM family further enhances Network FCRAM's position as the leading low latency DRAM solution for the networking and telecom market," said Scott Beekman, business development manager for communication memory products at TAEC. "Toshiba's networking and telecommunications customers will realize increased performance by incorporating these devices into communications equipment that requires consistent operation at extended temperature ranges."
Toshiba's Network FCRAM products address the needs of networking and communications customers by combining DRAM densities with random cycle performances that approach SRAM speeds. By design, the Network FCRAM provides high bandwidth, short random access, fast cycle times and a DDR interface using more cost-effective DRAM technology.
Technical Specifications TC59LM814CFTI/TC59LM806CFTI
Industrial Temp FCRAM1
Parameter -60
tCK, Clock Cycle Time (min) CL = 3 6.5ns
CL = 4 6.0ns
tRC, Random Read/Write Cycle Time(min) 30ns
tRAC, Random Access Time (max.) 26ns
IDD1S, Operating Current (max.) (single bank) 170mA
IDD2P, Standby Current (Power Down) (max.) 2mA
Operating Temperature Range (Ambient) -40 to +85 degrees C
Technical Specifications TC59LM818DMBI
Industrial Temp FCRAM2
Parameter -37
tCK, Clock Cycle Time (min) CL = 4 5.0ns
CL = 5 4.0ns
CL = 6 3.75ns
tRC, Random Read/Write Cycle Time(min) 25ns
tRAC, Random Access Time (max.) 25ns
IDD1S, Operating Current (max.) (single bank) 220mA
IDD2P, Standby Current (Power Down) (max.) 65mA
Operating Temperature Range (Case) -40 to +100 degrees C
Pricing and Availability
Toshiba's industrial temperature Network FCRAM2 (TC59LM818DMBI) chips are available now, priced at $30.00 each in sample quantities. The industrial temperature Network FCRAM1 (TC59LM814CFTI/TC59LM806CFTI) devices will be available 2Q04, priced at $24.00 each in sample quantities.
About Toshiba's Network FCRAM
Network FCRAM excels in applications where DRAM densities with random cycle performance approaching SRAM speeds are needed. Network FCRAMs are a higher performance replacement to DDR SDRAM for buffer memory and a lower cost replacement to high speed SRAM for look-up table memory in networking applications, offering designers many advantages in the area of cost and performance. Network FCRAMs also offer lower power consumption by narrowing the memory active areas and incorporating a proprietary core technology that achieves fast random access.
*About TAEC
Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes semiconductors, flash memory-based storage solutions, and displays for the computing, wireless, networking, automotive and digital consumer markets.
TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba, the third largest semiconductor company worldwide in terms of global sales for the year 2002 according to Gartner/Dataquest's Worldwide Semiconductor Market Share Ranking. Toshiba is a world leader in high-technology products with more than 300 major subsidiaries and affiliates worldwide. For additional company and product information, please visit TAEC's website at chips.toshiba.com. For technical inquiries, please e-mail Tech.Questions@taec.toshiba.com.
Information in this press release, including product pricing and specifications, content of services and contact information, is current on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.chips.toshiba.com/, or from your TAEC representative.
Network FCRAM is a trademark. All trademarks and tradenames held within are the properties of their respective holders.
CONTACT: Jan Johnson of MultiPath Communications, +1-714-633-4008,
jan@multipathcom.com, for Toshiba America Electronic Components, Inc.; or Lisa
Nemec of Toshiba America Electronic Components, Inc., +1-949-455-2293,
lisa.nemec@taec.toshiba.com
Web site: http://www.chips.toshiba.com/
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